(COMMUNIQUÉ DE PRESSE) DÜSSELDORF, Germany / NIJMEGEN, the Netherlands, 9-Aug-2022 — /EuropaWire/ — Henkel (ETR : HEN3), une entreprise allemande de produits chimiques et de biens de consommation, et Chip Integration Technology Center (CITC), un centre d’innovation conjoint à but non … Read the full press release →
Posted in Business, Chemicals, Germany, Industrial, Netherlands, Technology
Tagged Chip Integration Technology Center, CITC, die attach, die attach adhesives, Henkel, high-thermal die, Jeroen van den Brand, packaging platforms, power electronics, radio frequency, Ramachandran Trichur, RF, semiconductor packaging materials, sintering die attach materials
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